Invention Grant
- Patent Title: Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device
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Application No.: US15025473Application Date: 2014-09-18
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Publication No.: US10418161B2Publication Date: 2019-09-17
- Inventor: Shotaro Masuda , Hirofumi Ebe , Takashi Habu , Akihito Matsutomi
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils LLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2013-206710 20131001; JP2014-175877 20140829
- International Application: PCT/JP2014/074638 WO 20140918
- International Announcement: WO2015/049993 WO 20150409
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F1/28 ; H05K3/28 ; B22F1/00 ; H01F3/08 ; H05K1/03 ; C22C33/02 ; B22F7/04
Abstract:
Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.
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