公开(公告)号：US09357645B2

公开(公告)日：2016-05-31

申请号：US13804376

申请日：2013-03-14

Applicant: NITTO DENKO CORPORATION

Inventor： Hirofumi Ebe ,  Yoshihiro Furukawa

IPC: H05K1/09 ,  H05K3/32 ,  H05K3/36 ,  B23K35/24 ,  H05K1/11 ,  H05K13/04

CPC classification number: H05K1/092 ,  B23K35/24 ,  H05K1/11 ,  H05K3/323 ,  H05K3/368 ,  H05K13/04 ,  H05K2201/0129 ,  H05K2201/10977 ,  Y10T428/31529 ,  Y10T428/31678

Abstract: A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.

Abstract translation: 接合片包括含有焊料颗粒的焊料层，热塑性树脂和能够激活焊料颗粒的活性剂和层压在焊料层的厚度方向的至少一个表面上的热固性树脂含有层，以及 含有热固性树脂。

公开(公告)号：US10418161B2

公开(公告)日：2019-09-17

申请号：US15025473

申请日：2014-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Shotaro Masuda ,  Hirofumi Ebe ,  Takashi Habu ,  Akihito Matsutomi

IPC: H01F5/00 ,  H01F1/28 ,  H05K3/28 ,  B22F1/00 ,  H01F3/08 ,  H05K1/03 ,  C22C33/02 ,  B22F7/04

Abstract: Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.

公开(公告)号：US10373749B2

公开(公告)日：2019-08-06

申请号：US15025473

申请日：2014-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Shotaro Masuda ,  Hirofumi Ebe ,  Takashi Habu ,  Akihito Matsutomi

IPC: H01F5/00 ,  H01F1/28 ,  H05K3/28 ,  B22F1/00 ,  H01F3/08 ,  H05K1/03 ,  C22C33/02 ,  B22F7/04

Abstract: Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.

公开(公告)号：US09844147B2

公开(公告)日：2017-12-12

申请号：US14893834

申请日：2014-04-14

Applicant: NITTO DENKO CORPORATION

Inventor： Takashi Habu ,  Hirofumi Ebe

IPC: H05K3/00 ,  H05K1/16

CPC classification number: H05K3/0058 ,  H05K1/165 ,  H05K2201/0116 ,  H05K2201/0245 ,  H05K2201/086 ,  H05K2203/068 ,  H05K2203/085

Abstract: A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board includes the steps of bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of 15% or more and 60% or less, and in a semi-cured state into contact with the one side of the circuit board and bringing the soft magnetic thermosetting film into a cured state by vacuum hot pressing.