公开(公告)号：US10418161B2

公开(公告)日：2019-09-17

申请号：US15025473

申请日：2014-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Shotaro Masuda ,  Hirofumi Ebe ,  Takashi Habu ,  Akihito Matsutomi

IPC: H01F5/00 ,  H01F1/28 ,  H05K3/28 ,  B22F1/00 ,  H01F3/08 ,  H05K1/03 ,  C22C33/02 ,  B22F7/04

Abstract: Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.

公开(公告)号：US10373749B2

公开(公告)日：2019-08-06

申请号：US15025473

申请日：2014-09-18

Applicant: NITTO DENKO CORPORATION

Inventor： Shotaro Masuda ,  Hirofumi Ebe ,  Takashi Habu ,  Akihito Matsutomi

IPC: H01F5/00 ,  H01F1/28 ,  H05K3/28 ,  B22F1/00 ,  H01F3/08 ,  H05K1/03 ,  C22C33/02 ,  B22F7/04

Abstract: Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.

公开(公告)号：US10269477B2

公开(公告)日：2019-04-23

申请号：US15031042

申请日：2014-09-04

Applicant: NITTO DENKO CORPORATION

Inventor： Akihito Matsutomi ,  Takashi Habu

IPC: H01F1/36 ,  H01F1/26 ,  H05K9/00 ,  H01F1/37

Abstract: A soft magnetic resin composition contains flat soft magnetic particles, a resin component, and a rheology control agent.

公开(公告)号：US09844147B2

公开(公告)日：2017-12-12

申请号：US14893834

申请日：2014-04-14

Applicant: NITTO DENKO CORPORATION

Inventor： Takashi Habu ,  Hirofumi Ebe

IPC: H05K3/00 ,  H05K1/16

CPC classification number: H05K3/0058 ,  H05K1/165 ,  H05K2201/0116 ,  H05K2201/0245 ,  H05K2201/086 ,  H05K2203/068 ,  H05K2203/085

Abstract: A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board includes the steps of bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of 15% or more and 60% or less, and in a semi-cured state into contact with the one side of the circuit board and bringing the soft magnetic thermosetting film into a cured state by vacuum hot pressing.