Invention Grant
- Patent Title: Molded printhead
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Application No.: US15798108Application Date: 2017-10-30
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Publication No.: US10421279B2Publication Date: 2019-09-24
- Inventor: Chien-Hua Chen , Michael W. Cumbie
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- Priority: WOPCT/US2013/028216 20130228; WOPCT/US2013/046065 20130617
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/155 ; B41J2/175

Abstract:
In one example, a molded printhead includes a printhead die in a molding having a channel therein through which fluid may pass directly to a back part of the die. The front part of the die is exposed outside the molding surrounding the die. Electrical connections are made between terminals at the front part of the die and contacts to connect to circuitry external to the printhead.
Public/Granted literature
- US20180065374A1 MOLDED PRINTHEAD Public/Granted day:2018-03-08
Information query
IPC分类: