Invention Grant
- Patent Title: Exposure apparatus and method
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Application No.: US15744577Application Date: 2016-07-13
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Publication No.: US10423072B2Publication Date: 2019-09-24
- Inventor: Renbiao Xie , Zhiyong Yang , Angli Bai , Jian Wang
- Applicant: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Current Assignee: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201510416093 20150715
- International Application: PCT/CN2016/089881 WO 20160713
- International Announcement: WO2017/008740 WO 20170119
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G02B27/09 ; H01L33/00 ; H01L21/027 ; H01L21/67 ; H01L21/68

Abstract:
An exposure apparatus includes an exposure unit for exposing a wafer. The exposure unit includes an illumination system and masks. The illumination system includes a light-homogenizing unit. The light-homogenizing unit includes a light-homogenizing quartz rod having a regular hexagonal cross section. Each of the masks has a regular hexagonal shape matching with the cross section of the light-homogenizing quartz rod. A field of exposure resulting from this arrangement is less affected by objective field of view distortion and allows a higher useful depth of focus (UDoF) when compared to other fields of exposure of the same size. In addition, with the same projection objective DoF, a greater field of exposure can be obtained.
Public/Granted literature
- US20180203358A1 EXPOSURE APPARATUS AND METHOD Public/Granted day:2018-07-19
Information query
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