Invention Grant
- Patent Title: Method of manufacturing electronic component
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Application No.: US16009352Application Date: 2018-06-15
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Publication No.: US10424488B2Publication Date: 2019-09-24
- Inventor: Shogo Okita , Atsushi Harikai
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2016-040584 20160303
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; H01L21/308 ; H01L21/677 ; H01L21/78 ; H01L21/67 ; H01L21/683 ; H01L21/687
Abstract:
The yield of a product is improved when a substrate held by a conveyance carrier is subjected to a plasma treatment. A method of manufacturing an electronic component includes preparing a substrate which is bonded to a holding sheet of a conveyance carrier, the conveyance carrier including the holding sheet and a frame disposed on an outer peripheral portion of the holding sheet, the substrate having a circuit layer; heating the holding sheet after preparing the substrate; cooling the holding sheet after heating the holding sheet; and plasma etching the substrate to singulate the substrate into the electronic component in a state that the substrate is placed above a stage included in a plasma treatment apparatus and the substrate is in contact with the stage via the holding sheet.
Public/Granted literature
- US20180294164A1 METHOD OF MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2018-10-11
Information query
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