Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16284948Application Date: 2019-02-25
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Publication No.: US10424597B2Publication Date: 2019-09-24
- Inventor: Kang Sik Choi , Bong Hoon Lee , Seung Cheol Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2017-0076698 20170616
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/8238 ; H01L27/11582 ; G11C5/06 ; H01L29/66 ; H01L29/788 ; H01L27/11521 ; H01L27/11556 ; G11C16/04 ; H01L29/423

Abstract:
A semiconductor device includes a first semiconductor layer, a second semiconductor layer spaced apart from the first semiconductor layer and disposed on the first semiconductor layer, a gate stack structure disposed on the second semiconductor layer, a third semiconductor layer positioned between the first and second semiconductor layers, and a channel pillar passing through the gate stack structure, the second semiconductor layer and the third semiconductor layer and extending into the first semiconductor layer.
Public/Granted literature
- US20190189633A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-06-20
Information query
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