Invention Grant
- Patent Title: Gas plenum arrangement for improving etch non-uniformity in transformer-coupled plasma systems
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Application No.: US15291468Application Date: 2016-10-12
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Publication No.: US10431426B2Publication Date: 2019-10-01
- Inventor: Tom Kamp , Arthur H. Sato , Alex Paterson
- Applicant: LAM RESEARCH CORPORATION
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/3065 ; H01L21/67
Abstract:
A gas plenum arrangement for a substrate processing system includes a gas plenum body arranged to define a gas plenum between a coil and a processing chamber. The coil is arranged outside of an outer edge of the gas plenum body. A plurality of flux attenuating portions is arranged outside of the outer edge of the gas plenum body. The flux attenuation portions overlap the coil.
Public/Granted literature
- US20170032931A1 GAS PLENUM ARRANGEMENT FOR IMPROVING ETCH NON-UNIFORMITY IN TRANSFORMER-COUPLED PLASMA SYSTEMS Public/Granted day:2017-02-02
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