Invention Grant
- Patent Title: Finishing method for a metal surface
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Application No.: US15031611Application Date: 2014-02-18
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Publication No.: US10434541B2Publication Date: 2019-10-08
- Inventor: Kuan-Ting Wu , Chung-Hung Huang
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HPI Patent Department
- International Application: PCT/US2014/016964 WO 20140218
- International Announcement: WO2015/126370 WO 20150827
- Main IPC: B05D5/06
- IPC: B05D5/06 ; B05D7/00 ; B05D1/36 ; B44F9/10 ; B05D1/32

Abstract:
A surface finishing method comprises applying coatings of a hydrophobic material and a water-borne material to a surface of a metal substrate. First, a patterned coating of a first one of the hydrophobic or water-borne materials is applied to a surface of the metal substrate to partially cover the surface. A second fill coating of the other of the hydrophobic or water borne materials is then applied after the first patterned coating whereby the water borne material and the hydrophobic material repel and the second fill coating coats the surface of the metal substrate in areas uncoated by the first coating.
Public/Granted literature
- US20170120292A1 Finishing Method for a Metal Surface Public/Granted day:2017-05-04
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