公开(公告)号：US09983622B2

公开(公告)日：2018-05-29

申请号：US15021476

申请日：2013-10-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chung-Hung Huang ,  Yu-Chuan Kang ,  Chien-Ting Lin ,  Kuan-Ting Wu

IPC: G06F1/16 ,  B32B1/02 ,  C25D11/02 ,  B32B15/08 ,  C25D11/04 ,  C25D11/10 ,  C25D11/26 ,  C25D11/30 ,  H04M1/02

CPC classification number: G06F1/1626 ,  B32B1/02 ,  B32B15/08 ,  B32B2250/02 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2457/00 ,  C25D11/024 ,  C25D11/026 ,  C25D11/04 ,  C25D11/10 ,  C25D11/26 ,  C25D11/30 ,  G06F2200/1633 ,  H04M1/0283

Abstract: A method is provided for applying a transfer film to a metal surface. The method comprises electrochemically treating the metal to form an oxide layer, on to which a transfer film is applied.

公开(公告)号：US10244647B2

公开(公告)日：2019-03-26

申请号：US15031594

申请日：2014-02-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Yu-Chuan Kang ,  Chung-Hung Huang

IPC: H05K5/02 ,  H05K5/04 ,  H05H1/48 ,  C25D13/10 ,  C25D13/12 ,  C25D11/02 ,  C25D11/06 ,  C25D11/26 ,  C25D11/30 ,  C25D11/34 ,  C25D13/22 ,  C25D15/00 ,  C09D5/44 ,  C25D13/14

Abstract: A substrate with a Micro-Arc Oxidation (MAO) layer or an electrophoretic deposition (ED) layer on a first side of the substrate and an electrically insulating layer on a second side of the substrate.

公开(公告)号：US10434541B2

公开(公告)日：2019-10-08

申请号：US15031611

申请日：2014-02-18

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kuan-Ting Wu ,  Chung-Hung Huang

IPC: B05D5/06 ,  B05D7/00 ,  B05D1/36 ,  B44F9/10 ,  B05D1/32

Abstract: A surface finishing method comprises applying coatings of a hydrophobic material and a water-borne material to a surface of a metal substrate. First, a patterned coating of a first one of the hydrophobic or water-borne materials is applied to a surface of the metal substrate to partially cover the surface. A second fill coating of the other of the hydrophobic or water borne materials is then applied after the first patterned coating whereby the water borne material and the hydrophobic material repel and the second fill coating coats the surface of the metal substrate in areas uncoated by the first coating.

公开(公告)号：US10224673B2

公开(公告)日：2019-03-05

申请号：US15557941

申请日：2015-05-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chia-Min Sun ,  Chung-Hung Huang ,  Pei-Yu Wang

IPC: H01R13/639 ,  H01R13/627 ,  H01R12/75 ,  H01R12/71

Abstract: Examples disclosed herein provide a system including a holder to secure a removable module. In one example, the removable module includes a plug comprising holes. The system further includes a receptacle mounted on a printed circuit board (PCB). As an example, the receptacle includes elastic members to make contact with the holes in the plug when the receptacle is to accommodate the plug of the removable module. As an example, the holder is slidable over the receptacle to constrain the elastic members of the receptacle to maintain contact with the holes in the plug of the removable module.

公开(公告)号：US20180267572A1

公开(公告)日：2018-09-20

申请号：US15988175

申请日：2018-05-24

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chung-Hung Huang ,  Yu-Chuan Kang, JR. ,  Chien-Ting Lin ,  Kuan-Ting Wu

IPC: G06F1/16 ,  B32B1/02

CPC classification number: G06F1/1626 ,  B32B1/02 ,  B32B15/08 ,  B32B2250/02 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2457/00 ,  C25D11/024 ,  C25D11/026 ,  C25D11/04 ,  C25D11/10 ,  C25D11/26 ,  C25D11/30 ,  G06F2200/1633 ,  H04M1/0283

Abstract: A method is provided for applying a transfer film to a metal surface. The method comprises electrochemically treating the metal to form an oxide layer, on to which a transfer film is applied.