Invention Grant
- Patent Title: Defect reviewing method and device
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Application No.: US15126391Application Date: 2015-03-19
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Publication No.: US10436576B2Publication Date: 2019-10-08
- Inventor: Yohei Minekawa , Yuko Otani , Yuji Takagi
- Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe and Koenig, P.C.
- Priority: JP2014-086395 20140418
- International Application: PCT/JP2015/058233 WO 20150319
- International Announcement: WO2015/159641 WO 20151022
- Main IPC: G01B11/14
- IPC: G01B11/14 ; G02B21/36 ; G02B21/10 ; G02B21/00 ; G01N23/2251 ; G01N23/2204 ; G01B11/30 ; G01N21/956 ; G01N21/95 ; G02B5/30 ; G01N21/88

Abstract:
To review minute defects that were buried in roughness scattered light with an observation device provided with a dark-field microscope, a scanning electron microscope (SEM), and a control unit, the present invention configures the dark-field microscope by installing a filter for blocking a portion of the scattered light, an imaging lens for focusing the scattered light that has passed through the filter, and a detector for dividing the image of the scattered light focused by the imaging lens into the polarization directions converted by a wavelength plate and detecting the resulting images, and the control has a calculation unit for determining the position of a defect candidate detected by another inspection device using the plurality of images separated into polarization directions and detected by the detector.
Public/Granted literature
- US20170082425A1 DEFECT REVIEWING METHOD AND DEVICE Public/Granted day:2017-03-23
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