- Patent Title: Electronic component and substrate including electronic component
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Application No.: US15876247Application Date: 2018-01-22
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Publication No.: US10438749B2Publication Date: 2019-10-08
- Inventor: Yoshinao Nishioka , Yasuo Fujii
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2017-012026 20170126
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/252 ; H01G4/30 ; H01G4/008 ; H01G4/12 ; H01G4/248 ; H01G4/224 ; H01G4/232 ; H05K3/34

Abstract:
An electronic component includes a multilayer body including dielectric layers and inner electrodes alternately laminated together, first to third outer electrodes arranged in this order in one direction on a first main surface of the multilayer body, and fourth to sixth outer electrodes provided on a second main surface opposite to the first main surface such that at least a portion of the fourth outer electrode, at least a portion of the fifth outer electrode, and at least a portion of the sixth outer electrode respectively face the first outer electrode, the second outer electrode, and the third outer electrode. The first, third, and fifth outer electrodes are electrically connected to one another. The second, fourth, and sixth outer electrodes are electrically connected to one another and each have a polarity different from that of the first outer electrode.
Public/Granted literature
- US20180211785A1 ELECTRONIC COMPONENT AND SUBSTRATE INCLUDING ELECTRONIC COMPONENT Public/Granted day:2018-07-26
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