- Patent Title: Method for electrodeposition on a conductive particulate substrate
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Application No.: US15502573Application Date: 2015-02-18
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Publication No.: US10443144B2Publication Date: 2019-10-15
- Inventor: Amy Elizabeth Dyke , Michael Dunleavy
- Applicant: BAE SYSTEMS PLC
- Applicant Address: GB London
- Assignee: BAE Systems plc
- Current Assignee: BAE Systems plc
- Current Assignee Address: GB London
- Agency: Maine Cernota & Rardin
- Priority: GB1414431.5 20140814
- International Application: PCT/GB2015/050456 WO 20150218
- International Announcement: WO2016/024078 WO 20160218
- Main IPC: C25D7/00
- IPC: C25D7/00 ; C25D17/00 ; C25D21/10 ; C25D3/20 ; C25D5/00

Abstract:
The present invention relates to a method of electrodepositing a metal on an electrically conductive particulate substrate. There is provided a method of electrodepositing a metal on an electrically conductive particulate substrate comprising the steps of: (i) providing a cathode; (ii) providing an anode formed from the metal to be electrodeposited; (iii) providing the substrate, cathode and anode within an electrodeposition bath comprising an electrolyte; and (iv) providing a voltage between said anode and cathode causing metal ions to flow from the anode to the cathode, wherein a separator is provided between the anode and the cathode.
Public/Granted literature
- US20170241034A1 METHOD FOR ELECTRODEPOSITION ON A CONDUCTIVE PARTICULATE SUBSTRATE Public/Granted day:2017-08-24
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