发明授权
- 专利标题: Thermal sensor
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申请号: US15639318申请日: 2017-06-30
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公开(公告)号: US10444081B2公开(公告)日: 2019-10-15
- 发明人: Jaw-Juinn Horng , Szu-Lin Liu , Chung-Hui Chen
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Hauptman Ham, LLP
- 主分类号: G01K3/00
- IPC分类号: G01K3/00 ; G01K3/04 ; G01K7/01
摘要:
A circuit includes a first current source that provides a current and a resistive branch in series with the first current source that provides a first voltage value and a second voltage value. A capacitive device is coupled with a voltage node having a voltage value, and a switching network alternates between charging the capacitive device to have the voltage value increase to the first voltage value, and discharging the capacitive device to have the voltage value decrease to the second voltage value.
公开/授权文献
- US20170299442A1 THERMAL SENSOR 公开/授权日:2017-10-19
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