Invention Grant
- Patent Title: Resistor trimming method
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Application No.: US15516025Application Date: 2015-07-22
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Publication No.: US10446304B2Publication Date: 2019-10-15
- Inventor: Naoto Oka , Homare Sasaki
- Applicant: KOA Corporation
- Applicant Address: JP Ina-shi
- Assignee: KOA Corporation
- Current Assignee: KOA Corporation
- Current Assignee Address: JP Ina-shi
- Agency: Crowell & Moring LLP
- Priority: JP2014-205118 20141003
- International Application: PCT/JP2015/070868 WO 20150722
- International Announcement: WO2016/051939 WO 20160407
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/08 ; H01C17/242 ; B23K26/351 ; H01C17/00

Abstract:
The invention is to provide a resistor trimming method capable of adjusting a resistance value with ultrahigh precision and having excellent production efficiency. To achieve the object, a start point (S1) at a distance from a resistor (4) is irradiated with laser light while probes are brought into contact with a pair of surface electrodes (3) to measure a resistance value of the resistor (4). The place irradiated with the laser light is scanned so that a first trimming groove (5) extending in a direction perpendicular to a current direction can be formed in the resistor (4). Then, the place irradiated with the laser light is returned by a predetermined amount from an end point (first turning point (T1)) of the first trimming groove (5) to be set as a second turning point (T2). With the second turning point (T2) as a start point, scanning and cutting is performed to forma second trimming groove (6). Thus, the resistance value of the resistor (4) is adjusted to a target resistance value with high precision.
Public/Granted literature
- US20170301439A1 Resistor Trimming Method Public/Granted day:2017-10-19
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