Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US15840372Application Date: 2017-12-13
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Publication No.: US10446321B2Publication Date: 2019-10-15
- Inventor: Yohei Noda , Hirobumi Tanaka
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2016-242418 20161214
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; C03C10/00 ; C04B35/468 ; H01G4/224 ; C03C3/085 ; C03C3/087 ; C03C3/089 ; C03C3/091 ; C03C8/24 ; C03C14/00 ; H01C7/18 ; H01G4/232
Abstract:
The present invention relates to a multilayer electronic component which includes an element body where a plurality of internal electrode layers and dielectric layers are alternately laminated. Insulating layers are disposed on a pair of side surfaces of the element body, facing each other. The insulating layers contain a glass composition and a ceramic composition.
Public/Granted literature
- US20180166219A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2018-06-14
Information query
