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    Multilayer electronic component
    3.
    发明授权
    Multilayer electronic component 有权

    公开(公告)号：US09991054B2

    公开(公告)日：2018-06-05

    申请号：US15265206

    申请日：2016-09-14

    Applicant: TDK CORPORATION

    Inventor： Keisuke Okai ,  Hirobumi Tanaka ,  Yohei Noda

    IPC: H01G4/30 ,  H01G4/232 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/232

    Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces oppositely facing in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. An end portion in the first axis direction of the internal electrode layer is recessed from an end portion in the first axis direction of the dielectric layer to the inner side along the first axis direction. A main component of the internal electrode layer is Ni. A reaction portion is between the end portion in the first axis direction of the internal electrode layer and the insulating layer.

    Multilayer electronic component
    4.
    发明授权
    Multilayer electronic component 有权

    公开(公告)号：US09865397B2

    公开(公告)日：2018-01-09

    申请号：US15264939

    申请日：2016-09-14

    Applicant: TDK CORPORATION

    Inventor： Hirobumi Tanaka ,  Yohei Noda ,  Keisuke Okai ,  Makoto Endo

    IPC: H01G4/30 ,  H01G4/232 ,  H01G4/224 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232 ,  H01G4/2325

    Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. A main component of the insulating layer is constituted by glass containing Si at 25 wt % or more. The external electrode includes glass containing at least Si. The external electrode covers an end portion in the second axial direction of the insulating layer. A diffusing layer is partially present at least at a bonding portion of the insulating layer with the external electrode in the side surface.

    Multilayer electronic component
    6.
    发明授权
    Multilayer electronic component 有权

    公开(公告)号：US09870866B2

    公开(公告)日：2018-01-16

    申请号：US15265129

    申请日：2016-09-14

    Applicant: TDK CORPORATION

    Inventor： Yohei Noda ,  Hirobumi Tanaka ,  Hiroshi Shindo ,  Yui Sugiura ,  Tomomichi Gunji ,  Keisuke Okai

    IPC: H01G4/30 ,  H01G4/224 ,  H01G4/232 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232

    Abstract: A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. The insulating layer integrally has an insulating layer extension portion covering part of the end surfaces facing each other in the second axis direction. W1/W0 is 1/30 to less than ⅜, where W0 denotes a width along the first axis, and W1 denotes a width along the first axis of the insulating layer extension portion. The external electrode covers at least part of the insulating layer extension portion.

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