Invention Grant
- Patent Title: Method and structure for enabling controlled spacer RIE
-
Application No.: US15489303Application Date: 2017-04-17
-
Publication No.: US10446452B2Publication Date: 2019-10-15
- Inventor: Kangguo Cheng , Ryan O. Jung , Fee Li Lie , Eric R. Miller , Jeffrey C. Shearer , John R. Sporre , Sean Teehan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Steven J. Meyers
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/84 ; H01L21/311 ; H01L21/3105 ; H01L21/308 ; H01L21/66 ; H01L27/12 ; H01L21/8234

Abstract:
A method and structure to enable reliable dielectric spacer endpoint detection by utilizing a sacrificial spacer fin are provided. The sacrificial spacer fin that is employed has a same pitch as the pitch of each semiconductor fin and the same height as the dielectric spacers on the sidewalls of each semiconductor fin. Exposed portions of the sacrificial spacer fin are removed simultaneously during a dielectric spacer reactive ion etch (RIE). The presence of the sacrificial spacer fin improves the endpoint detection of the spacer RIE and increases the endpoint signal intensity.
Public/Granted literature
- US20170221773A1 METHOD AND STRUCTURE FOR ENABLING CONTROLLED SPACER RIE Public/Granted day:2017-08-03
Information query
IPC分类: