Invention Grant
- Patent Title: Semiconductor device package structure
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Application No.: US15351241Application Date: 2016-11-14
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Publication No.: US10446454B2Publication Date: 2019-10-15
- Inventor: Yu-An Fang , Ying-Chung Chen , Cheng-Ling Huang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/053
- IPC: H01L23/053 ; H01L23/10 ; B81B7/00 ; B81C1/00 ; H01L23/04 ; H01L21/683
Abstract:
A semiconductor device package comprises a carrier having a through hole. A lid is over the carrier and comprises a first side wall, a second side wall, and a connection wall. The second side wall is opposite the first side wall, and the connection wall is between the first side wall and the second side wall. The lid and the carrier form a plurality of chambers. The first side wall, the second side wall and the connection wall form a space to fluidly connect the plurality of chambers.
Public/Granted literature
- US20180138099A1 SEMICONDUCTOR DEVICE PACKAGE STRUCTURE Public/Granted day:2018-05-17
Information query
IPC分类:
