公开(公告)号：US11551963B2

公开(公告)日：2023-01-10

申请号：US16791938

申请日：2020-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Ling Ma ,  Ying-Chung Chen ,  Hsin-Ying Ho ,  Cheng-Ling Huang ,  Chang Chin Tsai

IPC: H01L33/00 ,  H01L33/18 ,  H01L21/82 ,  H01L21/683 ,  H01L31/18

Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.

公开(公告)号：US10812017B1

公开(公告)日：2020-10-20

申请号：US16530710

申请日：2019-08-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ching-Han Huang ,  Hui-Chung Liu ,  Kuo-Hua Lai ,  Cheng-Ling Huang

IPC: H03B5/04 ,  H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H03B5/30 ,  H01L23/14 ,  B81B7/00 ,  H03B5/36 ,  H03L1/04 ,  H03B1/02

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

公开(公告)号：US11296651B2

公开(公告)日：2022-04-05

申请号：US17074618

申请日：2020-10-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ching-Han Huang ,  Hui-Chung Liu ,  Kuo-Hua Lai ,  Cheng-Ling Huang

IPC: H03B5/04 ,  H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H03B5/30 ,  H01L23/14 ,  B81B7/00 ,  H03B5/36 ,  H03L1/04 ,  H03B1/02

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

公开(公告)号：US10446454B2

公开(公告)日：2019-10-15

申请号：US15351241

申请日：2016-11-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-An Fang ,  Ying-Chung Chen ,  Cheng-Ling Huang

IPC: H01L23/053 ,  H01L23/10 ,  B81B7/00 ,  B81C1/00 ,  H01L23/04 ,  H01L21/683

Abstract: A semiconductor device package comprises a carrier having a through hole. A lid is over the carrier and comprises a first side wall, a second side wall, and a connection wall. The second side wall is opposite the first side wall, and the connection wall is between the first side wall and the second side wall. The lid and the carrier form a plurality of chambers. The first side wall, the second side wall and the connection wall form a space to fluidly connect the plurality of chambers.

公开(公告)号：US11682684B2

公开(公告)日：2023-06-20

申请号：US17066412

申请日：2020-10-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling Huang ,  Lu-Ming Lai ,  Ying-Chung Chen

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14685

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.

公开(公告)号：US10910507B2

公开(公告)日：2021-02-02

申请号：US15619414

申请日：2017-06-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling Huang ,  Ying-Chung Chen

IPC: H01L31/16 ,  A61B5/00 ,  A61B5/0408 ,  H01L31/0203

Abstract: A semiconductor package device comprises a substrate, a light emitter, a light detector and a transparent conductive film. The substrate as a first surface and a second surface opposite to the first surface. The light emitter is disposed on the first surface of the substrate and has a light emission area adjacent to the first surface of the substrate. The light detector is disposed on the first surface of the substrate and has a light receiving area adjacent to the first surface of the substrate. The transparent conducting film is disposed on the second surface of the substrate.

公开(公告)号：US20180138099A1

公开(公告)日：2018-05-17

申请号：US15351241

申请日：2016-11-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-An FANG ,  Ying-Chung Chen ,  Cheng-Ling Huang

IPC: H01L23/053 ,  H01L23/10

CPC classification number: H01L23/053 ,  B81B7/0032 ,  B81B7/0061 ,  B81C1/00269 ,  B81C1/00309 ,  H01L21/6836 ,  H01L23/04 ,  H01L23/10 ,  H01L2221/68331

Abstract: A semiconductor device package comprises a carrier having a through hole. A lid is over the carrier and comprises a first side wall, a second side wall, and a connection wall. The second side wall is opposite the first side wall, and the connection wall is between the first side wall and the second side wall. The lid and the carrier form a plurality of chambers. The first side wall, the second side wall and the connection wall form a space to fluidly connect the plurality of chambers.