Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15822284Application Date: 2017-11-27
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Publication No.: US10446671B2Publication Date: 2019-10-15
- Inventor: Satoru Okamoto , Shinya Sasagawa
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2015-041204 20150303
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/786 ; H01L29/66 ; H01L29/22 ; H01L29/24 ; H01L29/40 ; H01L29/78 ; H01L21/385 ; H01L27/12

Abstract:
A minute transistor is provided. A transistor with low parasitic capacitance is provided. A transistor having high frequency characteristics is provided. A semiconductor device including the transistor is provided. A semiconductor device includes an oxide semiconductor, a first conductor, a second conductor, a third conductor, a first insulator, and a second insulator. The first conductor overlaps with the oxide semiconductor with the first insulator positioned therebetween. The second insulator has an opening and a side surface of the second insulator overlaps with a side surface of the first conductor in the opening with the first insulator positioned therebetween. Part of a surface of the second conductor and part of a surface of the third conductor are in contact with the first insulator in the opening. The oxide semiconductor overlaps with the second conductor and the third conductor.
Public/Granted literature
- US20180108760A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-04-19
Information query
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