Invention Grant
- Patent Title: Back-illuminated sensor with boron layer
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Application No.: US16151225Application Date: 2018-10-03
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Publication No.: US10446696B2Publication Date: 2019-10-15
- Inventor: Jehn-Huar Chern , Ali R. Ehsani , Gildardo Delgado , David L. Brown , Yung-Ho Alex Chuang , John Fielden
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Bever, Hoffman & Harms, LLP
- Main IPC: G01N21/88
- IPC: G01N21/88 ; G01N21/95 ; H01L31/0216 ; G01N21/956 ; H01L27/146 ; H01L27/148

Abstract:
An inspection system including an optical system (optics) to direct light from an illumination source to a sample, and to direct light reflected/scattered from the sample to one or more image sensors. At least one image sensor of the system is formed on a semiconductor membrane including an epitaxial layer having opposing surfaces, with circuit elements formed on one surface of the epitaxial layer, and a pure boron layer and a doped layer on the other surface of the epitaxial layer. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor. The image sensor can be included in an electron-bombarded image sensor and/or in an inspection system.
Public/Granted literature
- US20190131465A1 BACK-ILLUMINATED SENSOR WITH BORON LAYER Public/Granted day:2019-05-02
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