Invention Grant
- Patent Title: Three dimensional integrated-circuits
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Application No.: US15893537Application Date: 2018-02-09
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Publication No.: US10447272B2Publication Date: 2019-10-15
- Inventor: Raminda Udaya Madurawe
- Applicant: CALLAHAN CELLULAR L.L.C.
- Applicant Address: US DE Wilmington
- Assignee: CALLAHAN CELLULAR L.L.C.
- Current Assignee: CALLAHAN CELLULAR L.L.C.
- Current Assignee Address: US DE Wilmington
- Main IPC: H03K19/177
- IPC: H03K19/177 ; H03K19/173 ; H01L21/822 ; H01L27/06

Abstract:
A three-dimensional semiconductor device, comprising: a first module layer having a plurality of circuit blocks; and a second module layer positioned substantially above the first module layer, including a plurality of configuration circuits; and a third module layer positioned substantially above the second module layer, including a plurality of circuit blocks; wherein, the configuration circuits in the second module control a portion of the circuit blocks in the first and third module layers.
Public/Granted literature
- US20180167071A1 THREE DIMENSIONAL INTEGRATED CIRCUITS Public/Granted day:2018-06-14
Information query
IPC分类: