Invention Grant
- Patent Title: Surface adhesive for devices
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Application No.: US14591483Application Date: 2015-01-07
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Publication No.: US10449750B2Publication Date: 2019-10-22
- Inventor: Carlos Caicedo-Carvajal , Randy Clevenger , Sam Hong , Jordan Katz , Cheoljin Kim
- Applicant: Orthobond Corporation
- Applicant Address: US NJ North Brunswick
- Assignee: Orthobond Corporation
- Current Assignee: Orthobond Corporation
- Current Assignee Address: US NJ North Brunswick
- Agency: Venable LLP
- Main IPC: B32B7/12
- IPC: B32B7/12 ; C09J175/14 ; B32B7/10 ; B32B27/06 ; B32B27/08 ; B32B27/16 ; B32B27/28 ; B32B27/36 ; B32B5/06 ; B32B27/30 ; B32B27/34 ; B32B27/38 ; B32B27/40
Abstract:
Disclosed in certain embodiments is a composition comprising a first material; an adhesive material attached to the first material; a plurality of linker molecules bonded to the adhesive material; and a second material bonded to the linker molecules.
Public/Granted literature
- US20150190983A1 Surface Adhesive for Devices Public/Granted day:2015-07-09
Information query
