A method for manufacturing a multilayer ceramic electronic component includes preparing a laminate including internal electrodes stacked through a ceramic green sheet, the internal electrodes being exposed on a surface of the laminate, heating a functional sheet while the functional sheet is in contact with a predetermined surface of the laminate, on which the internals electrode are exposed, cooling the heated functional sheet, and forming a covering layer formed of the functional sheet on the predetermined surface of the laminate by punching out the functional sheet having been cooled with the laminate.