Invention Grant
- Patent Title: Molding for large panel fan-out package
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Application No.: US15675610Application Date: 2017-08-11
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Publication No.: US10453764B2Publication Date: 2019-10-22
- Inventor: Shao-An Chen , Po-Wei Lu , Ming Tsung Shen , Yu-Tzu Peng
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L23/538
Abstract:
The present disclosure relates to wafer level packages including one or more semiconductor dies and a method of manufacturing the same. A method comprises: providing a carrier having a predetermined area, disposing a semiconductor device on the predetermined area, and forming a sacrificial wall on a periphery of the predetermined area.
Public/Granted literature
- US20180047651A1 MOLDING FOR LARGE PANEL FAN-OUT PACKAGE Public/Granted day:2018-02-15
Information query
IPC分类:
