公开(公告)号：US10453764B2

公开(公告)日：2019-10-22

申请号：US15675610

申请日：2017-08-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-An Chen ,  Po-Wei Lu ,  Ming Tsung Shen ,  Yu-Tzu Peng

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/538

Abstract: The present disclosure relates to wafer level packages including one or more semiconductor dies and a method of manufacturing the same. A method comprises: providing a carrier having a predetermined area, disposing a semiconductor device on the predetermined area, and forming a sacrificial wall on a periphery of the predetermined area.