Invention Grant
- Patent Title: Packaged semiconductor device having a shielding against electromagnetic interference and manufacturing process thereof
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Application No.: US15658165Application Date: 2017-07-24
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Publication No.: US10455692B2Publication Date: 2019-10-22
- Inventor: Federico Giovanni Ziglioli
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed Intellectual Property Law Group LLP
- Priority: ITTO2014A0076 20140131
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H05K1/02 ; H05K7/02 ; H01L23/13 ; H01L23/00 ; H01L23/31 ; H01L21/56
Abstract:
A packaged device has a die of semiconductor material bonded to a support. An electromagnetic shielding structure surrounds the die and is formed by a grid structure of conductive material extending into the support and an electromagnetic shield, coupled together. A packaging mass embeds both the die and the electromagnetic shield. The electromagnetic shield is formed by a plurality of metal ribbon sections overlying the die and embedded in the packaging mass. Each metal ribbon section has a thickness-to-width ratio between approximately 1:2 and approximately 1:50.
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Information query
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