Invention Grant
- Patent Title: Anodization of bonded assembly
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Application No.: US15656571Application Date: 2017-07-21
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Publication No.: US10458035B2Publication Date: 2019-10-29
- Inventor: John Harner , John D. Riehl , William Bogue , Gary A. Wigell , Brandon A. Gates , Michael A. Morden , Thomas M. Morin
- Applicant: UNITED TECHNOLOGIES CORPORATION
- Applicant Address: US CT Farmington
- Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee: UNITED TECHNOLOGIES CORPORATION
- Current Assignee Address: US CT Farmington
- Agency: Snell & Wilmer, L.L.P.
- Main IPC: C25D11/12
- IPC: C25D11/12 ; B64F5/40 ; C25D11/02 ; C25D11/08 ; C25D11/26 ; F01D5/28 ; F02C3/04 ; C25D11/04 ; C25D17/00
Abstract:
A method for anodizing a bonded assembly may include attaching a first electrode to a first component of the bonded assembly, and forming a first oxide layer on the first component. The bonded assembly may comprise the first component and a second component bonded to the first component. The second component may be electrically isolated from the first component.
Public/Granted literature
- US20190024255A1 ANODIZATION OF BONDED ASSEMBLY Public/Granted day:2019-01-24
Information query
