公开(公告)号：US10458035B2

公开(公告)日：2019-10-29

申请号：US15656571

申请日：2017-07-21

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： John Harner ,  John D. Riehl ,  William Bogue ,  Gary A. Wigell ,  Brandon A. Gates ,  Michael A. Morden ,  Thomas M. Morin

IPC: C25D11/12 ,  B64F5/40 ,  C25D11/02 ,  C25D11/08 ,  C25D11/26 ,  F01D5/28 ,  F02C3/04 ,  C25D11/04 ,  C25D17/00

Abstract: A method for anodizing a bonded assembly may include attaching a first electrode to a first component of the bonded assembly, and forming a first oxide layer on the first component. The bonded assembly may comprise the first component and a second component bonded to the first component. The second component may be electrically isolated from the first component.

公开(公告)号：US20190024255A1

公开(公告)日：2019-01-24

申请号：US15656571

申请日：2017-07-21

Applicant: UNITED TECHNOLOGIES CORPORATION

Inventor： John Harner ,  John D. Riehl ,  William Bogue ,  Gary A. Wigell ,  Brandon A. Gates ,  Michael A. Morden ,  Thomas M. Morin

IPC: C25D11/12 ,  C25D11/26 ,  C25D11/02 ,  C25D11/08 ,  B64F5/40 ,  F02C3/04 ,  F01D5/28

CPC classification number: C25D11/12 ,  B64F5/40 ,  C25D11/022 ,  C25D11/04 ,  C25D11/08 ,  C25D11/26 ,  C25D17/005 ,  F01D5/288 ,  F02C3/04 ,  F05D2230/90

Abstract: A method for anodizing a bonded assembly may include attaching a first electrode to a first component of the bonded assembly, and forming a first oxide layer on the first component. The bonded assembly may comprise the first component and a second component bonded to the first component. The second component may be electrically isolated from the first component.