Invention Grant
- Patent Title: Method of detaching semiconductor material from a carrier and device for performing the method
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Application No.: US15137022Application Date: 2016-04-25
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Publication No.: US10460972B2Publication Date: 2019-10-29
- Inventor: Adolf Koller , Florian Sedlmeier
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102015106448 20150427
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/67 ; H01L21/78
Abstract:
Various embodiments provide a method of detaching semiconductor material from a carrier, wherein the method comprises providing a carrier having attached thereto a layer of semiconductor material, wherein the layer comprises an edge portion; and guiding an air stream onto the edge portion of the layer of semiconductor material.
Public/Granted literature
- US20160315012A1 Method of detaching semiconductor material from a carrier and device for performing the method Public/Granted day:2016-10-27
Information query
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