Invention Grant
- Patent Title: Method of manufacturing semiconductor device and the semiconductor device
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Application No.: US15966773Application Date: 2018-04-30
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Publication No.: US10461159B2Publication Date: 2019-10-29
- Inventor: Hironobu Miyamoto , Tatsuo Nakayawa , Yasuhiro Okamoto , Atsushi Tsuboi
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2017-104177 20170526
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/20 ; H01L21/02 ; H01L29/423 ; H01L29/08 ; H01L29/43 ; H01L29/51 ; H01L29/66 ; H01L29/778 ; H01L29/40

Abstract:
Characteristics of a semiconductor device using a nitride semiconductor are improved. A semiconductor device of the present invention includes a buffer layer, a channel layer, a barrier layer, a mesa-type 2DEG dissolving layer, a source electrode, a drain electrode, a gate insulating film formed on the mesa-type 2DEG dissolving layer, and an overlying gate electrode. The gate insulating film of the semiconductor device includes a sputtered film formed on the mesa-type 2DEG dissolving layer and a CVD film formed on the sputtered film. The sputtered film is formed in a non-oxidizing atmosphere by a sputtering process using a target including an insulator. This makes it possible to reduce positive charge amount at a MOS interface and in gate insulating film and increase a threshold voltage, and thus improve normally-off characteristics.
Public/Granted literature
- US20180342589A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE Public/Granted day:2018-11-29
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