Invention Grant
- Patent Title: Multi-port multi-sideband-GPIO consolidation technique over a multi-drop serial bus
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Application No.: US15864871Application Date: 2018-01-08
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Publication No.: US10467154B2Publication Date: 2019-11-05
- Inventor: Lalan Jee Mishra , Richard Dominic Wietfeldt , Christopher Kong Yee Chun , Mohit Prasad , Chris Rosolowski
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Loza & Loza LLP
- Main IPC: G06F13/12
- IPC: G06F13/12 ; G06F13/364 ; G06F13/40 ; G06F13/42 ; G06F15/78

Abstract:
Systems, methods, and apparatus for communication virtualized general-purpose input/output signals over a serial communication link A method performed at a transmitting device coupled to a communication link includes configuring general-purpose input/output (GPIO) state from a plurality of sources into a virtual general-purpose input/output word, identifying one or more destinations for the first GPIO word based on a mapping of the GPIO state to one or more devices coupled to a serial bus, and transmitting the first GPIO word to each destination.
Public/Granted literature
- US20180232324A1 MULTI-PORT MULTI-SIDEBAND-GPIO CONSOLIDATION TECHNIQUE OVER A MULTI-DROP SERIAL BUS Public/Granted day:2018-08-16
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