Invention Grant
- Patent Title: Imaging element, stacked-type imaging element, solid-state imaging device, and driving method for solid-state imaging device
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Application No.: US15796545Application Date: 2017-10-27
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Publication No.: US10468451B2Publication Date: 2019-11-05
- Inventor: Hideaki Togashi , Fumihiko Koga , Tetsuji Yamaguchi , Shintarou Hirata , Taiichiro Watanabe , Yoshihiro Ando , Toyotaka Kataoka , Satoshi Keino , Yukio Kaneda
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sheridan Ross P.C.
- Priority: JP2016-038777 20160301; JP2016-193919 20160930
- Main IPC: H04L27/148
- IPC: H04L27/148 ; H04N5/378 ; H01L27/148 ; H01L51/42 ; H01L51/44 ; H01L27/146 ; H01L27/30
Abstract:
An imaging device is provided. The imaging device may include a substrate having a first photoelectric conversion unit and a second photoelectric conversion unit at a light-incident side of the substrate. The second photoelectric conversion unit may include a photoelectric conversion layer, a first electrode, a second electrode above the photoelectric conversion layer, a third electrode, and an insulating material between the third electrode and the photoelectric conversion layer, wherein a portion of the insulating material is between the first electrode and the third electrode.
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