Invention Grant
- Patent Title: High strength, high conductivity electroformed copper alloys and methods of making
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Application No.: US15376371Application Date: 2016-12-12
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Publication No.: US10472709B2Publication Date: 2019-11-12
- Inventor: Daniel T. McDonald , James A. Wright , Wai Man Raymund Kwok
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Polsinelli PC
- Main IPC: C22C9/00
- IPC: C22C9/00 ; C22F1/08 ; C25D1/00 ; C25D3/38 ; H01R13/03 ; H01R4/58
Abstract:
An electroformed binary copper alloy comprising copper and X, where X is selected from the group consisting of Cr, Fe, W, Mo, B, Co, Ag, and P, having a yield strength of at least 600 MPa and an electrical conductivity of at least 20% IACS is disclosed.
Public/Granted literature
- US20170167007A1 High Strength, High Conductivity Electroformed Copper Alloys and Methods of Making Public/Granted day:2017-06-15
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