公开(公告)号：US11345121B2

公开(公告)日：2022-05-31

申请号：US16144847

申请日：2018-09-27

Applicant: Apple Inc.

Inventor： Yoshihiko Yokoyama ,  Naoto Matsuyuki ,  James A. Wright ,  Brian M. Gable ,  William A. Counts ,  Eric W. Hamann

IPC: B32B15/01 ,  B32B7/12 ,  B23K11/20 ,  B23K11/11 ,  B23K20/12 ,  B23K20/227 ,  B23K11/34 ,  B23K20/233 ,  B23K11/00 ,  B32B37/06 ,  B32B37/10 ,  B23K103/10 ,  B23K103/20 ,  B23K103/04 ,  B23K101/38 ,  B23K103/18

Abstract: The disclosure provides an aluminized composite including a base material. The aluminized composite may also include a diffusion layer disposed over the base material. The aluminized composite may further include an aluminum material disposed over the diffusion layer.

公开(公告)号：US10327348B2

公开(公告)日：2019-06-18

申请号：US15581433

申请日：2017-04-28

Applicant: Apple Inc.

Inventor： James A. Wright ,  Guangtao Zhang ,  Raymund W. M. Kwok ,  Karl Ruben F. Larsson ,  Christopher S. Graham ,  Matthew D. Hill ,  Abhijeet Misra

IPC: H05K5/04 ,  H02J50/10 ,  H01Q7/00 ,  H05K5/03 ,  G06F1/18 ,  H04M1/02 ,  H01Q1/38 ,  H05K7/14

Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.

公开(公告)号：US20180103557A1

公开(公告)日：2018-04-12

申请号：US15581433

申请日：2017-04-28

Applicant: Apple Inc.

Inventor： James A. Wright ,  Guangtao Zhang ,  Raymund W.M. Kwok ,  Karl Ruben F. Larsson ,  Christopher S. Graham ,  Matthew D. Hill ,  Abhijeet Misra

IPC: H05K5/04 ,  H05K7/14 ,  H02J50/10 ,  H05K5/03 ,  H01Q1/38 ,  H01Q7/00

CPC classification number: H05K5/04 ,  G06F1/182 ,  H01Q1/38 ,  H01Q7/00 ,  H02J50/10 ,  H04M1/0202 ,  H05K5/03 ,  H05K7/1427

Abstract: An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.

公开(公告)号：US20180016667A1

公开(公告)日：2018-01-18

申请号：US15406153

申请日：2017-01-13

Applicant: Apple Inc.

Inventor： Abhijeet Misra ,  James A. Wright ,  Herng-Jeng Jou

IPC: C22F1/053 ,  C22C21/10 ,  C22C1/02

CPC classification number: C22F1/053 ,  C22C1/02 ,  C22C1/026 ,  C22C21/10

Abstract: The disclosure provides aluminum alloys having varying ranges of alloying elements and properties.

公开(公告)号：US11207795B1

公开(公告)日：2021-12-28

申请号：US16137434

申请日：2018-09-20

Applicant: Apple Inc.

Inventor： Jeffrey L. Mattlin ,  Abhijeet Misra ,  Herng-Jeng Jou ,  James A. Wright ,  James A. Yurko ,  Lei Gao ,  Weiming Huang ,  William A. Counts

IPC: B28B7/36 ,  B29C43/32

Abstract: A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600° C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

公开(公告)号：US20200239990A1

公开(公告)日：2020-07-30

申请号：US16851466

申请日：2020-04-17

Applicant: Apple Inc.

Inventor： Brian M. Gable ,  James A. Wright ,  Charles J. Kuehmann ,  Brian Demers ,  Chune-Ching Young ,  Chun-Hsien Chiang

IPC: C22F1/053 ,  C22C21/10

Abstract: The disclosure provides an aluminum alloy including having varying ranges of alloying elements. In various aspects, the alloy has a wt % ratio of Zn to Mg ranging from 4:1 to 7:1. The disclosure further includes methods for producing an aluminum alloy and articles comprising the aluminum alloy.

公开(公告)号：US20200181746A1

公开(公告)日：2020-06-11

申请号：US16790151

申请日：2020-02-13

Applicant: Apple Inc.

Inventor： Brian M. Gable ,  James A. Wright ,  Charles J. Kuehmann ,  Brian Demers ,  Chune-Ching Young ,  Chun-Hsien Chiang

IPC: C22F1/053 ,  C22C21/10

Abstract: The disclosure provides an aluminum alloy including having varying ranges of alloying elements. In various aspects, the alloy has a wt % ratio of Zn to Mg ranging from 4:1 to 7:1. The disclosure further includes methods for producing an aluminum alloy and articles comprising the aluminum alloy.

公开(公告)号：US10427380B2

公开(公告)日：2019-10-01

申请号：US15159573

申请日：2016-05-19

Applicant: Apple Inc.

Inventor： Charles J. Kuehmann ,  Christopher M. Werner ,  Colin M. Ely ,  James A. Wright

IPC: H01B1/02 ,  B32B15/01 ,  C23C2/04 ,  B23K103/04 ,  B23K103/08

Abstract: The methods including applying a corrosion resistant alloy to a metal substrate to create a bimetal blank. The bimetal blank can undergo a variety of shaping and machining operations to form the net shape and internal structures of the part. Further, the part can undergo a finishing operation (e.g. polishing) to create the desired cosmetic appearance on the exterior surfaces and remove any surface imperfections resulting from the shaping and machining operations.

公开(公告)号：US20170306446A1

公开(公告)日：2017-10-26

申请号：US15647008

申请日：2017-07-11

Applicant: Apple Inc.

Inventor： Zechariah D. Feinberg ,  James A. Wright

IPC: C22C5/02 ,  H05K5/04

CPC classification number: C22C5/02 ,  H05K5/04

Abstract: The disclosure provides gold alloys. The alloys can have improved strength and hardness. The gold alloys can have various gold colors, including yellow gold and rose gold. The gold alloys can be used as enclosures for electronic devices.

公开(公告)号：US20150071814A1

公开(公告)日：2015-03-12

申请号：US14482716

申请日：2014-09-10

Applicant: Apple Inc.

Inventor： Zechariah D. Feinberg ,  James A. Wright

IPC: C22C5/02

CPC classification number: C22C5/02 ,  H05K5/04

Abstract: The disclosure provides gold alloys. The alloys can have improved strength and hardness. The gold alloys can have various gold colors, including yellow gold and rose gold. The gold alloys can be used as enclosures for electronic devices.

Abstract translation: 本公开提供了金合金。 合金可以提高强度和硬度。 金合金可以有各种金色，包括黄金和玫瑰金。 金合金可用作电子设备的外壳。