Invention Grant
- Patent Title: Integrated circuit chip stack
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Application No.: US16125096Application Date: 2018-09-07
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Publication No.: US10473709B2Publication Date: 2019-11-12
- Inventor: Alexandre Sarafianos , Thomas Ordas
- Applicant: STMicroelectronics (Rousset) SAS
- Applicant Address: FR Rousset
- Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Rousset
- Agency: Crowe & Dunlevy
- Priority: FR1758340 20170911
- Main IPC: H01L23/00
- IPC: H01L23/00 ; G01R31/12 ; G06K19/073 ; H01L25/065 ; G01R31/317 ; H01L23/538

Abstract:
An integrated circuit chip stack includes a main integrated circuit chip and at least one auxiliary integrated circuit chip. The main integrated circuit chip contains circuit components to be protected. The auxiliary integrated circuit chip is mounted to a surface of the main integrated circuit chip and includes a metal plane connected to ground located opposite the circuit components to be protected. The auxiliary integrated circuit chip further includes at least one insulated conductive track forming a tight pattern opposite the circuit components to be protected. A detection circuit is connected to the at least one conductive track and is configured to detect interruption of the at least one insulated conductive track.
Public/Granted literature
- US20190079133A1 INTEGRATED CIRCUIT CHIP STACK Public/Granted day:2019-03-14
Information query
IPC分类: