Invention Grant
- Patent Title: Method and apparatus for post exposure processing of photoresist wafers
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Application No.: US15692087Application Date: 2017-08-31
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Publication No.: US10474033B2Publication Date: 2019-11-12
- Inventor: Viachslav Babayan , Douglas A. Buchberger, Jr. , Qiwei Liang , Ludovic Godet , Srinivas D. Nemani , Daniel J. Woodruff , Randy Harris , Robert B. Moore
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: G03D5/00
- IPC: G03D5/00 ; G03F7/20 ; H01L21/687 ; G03F7/16 ; G03F7/26 ; G03F7/38

Abstract:
Embodiments described herein relate to methods and apparatus for performing immersion field guided post exposure bake processes. Embodiments of apparatus described herein include a chamber body defining a processing volume. A pedestal may be disposed within the processing volume and a first electrode may be coupled to the pedestal. A moveable stem may extend through the chamber body opposite the pedestal and a second electrode may be coupled to the moveable stem. In certain embodiments, a fluid containment ring may be coupled to the pedestal and a dielectric containment ring may be coupled to the second electrode.
Public/Granted literature
- US20170363960A1 METHOD AND APPARATUS FOR POST EXPOSURE PROCESSING OF PHOTORESIST WAFERS Public/Granted day:2017-12-21
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