- 专利标题: Vertical gate-all-around transistor and manufacturing method thereof
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申请号: US15727380申请日: 2017-10-06
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公开(公告)号: US10475744B2公开(公告)日: 2019-11-12
- 发明人: Kuan-Hung Chen , Rung-Yuan Lee , Chun-Tsen Lu
- 申请人: United Microelectronics Corp.
- 申请人地址: TW Hsinchu
- 专利权人: United Microelectronics Corp.
- 当前专利权人: United Microelectronics Corp.
- 当前专利权人地址: TW Hsinchu
- 代理机构: J.C. Patents
- 优先权: CN201710800066 20170907
- 主分类号: H01L23/532
- IPC分类号: H01L23/532 ; H01L21/02 ; H01L21/762 ; H01L29/423 ; H01L29/06 ; B82Y99/00
摘要:
A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a substrate, an isolation structure, an outer structure, and a gate structure. The isolation structure is disposed on the substrate. The outer structure surrounds a sidewall of the isolation structure. The gate structure surrounds a central part of the outer structure, so that the central part covered by the gate structure becomes a channel region, and the outer structure at both sides of the central part respectively becomes a source region and a drain region.
公开/授权文献
- US20190074250A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 公开/授权日:2019-03-07
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