Invention Grant
- Patent Title: Asymmetric gate pitch
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Application No.: US15885596Application Date: 2018-01-31
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Publication No.: US10475790B2Publication Date: 2019-11-12
- Inventor: Wei-Barn Chen , Chi-Cherng Jeng , Shiu-Ko Jangjian , Ting-Huang Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/06

Abstract:
The present disclosure describes an exemplary asymmetric CPP layout for a semiconductor structure with a different gate pitch over the source and the drain regions to mitigate gate-to-gate parasitic capacitances over the drain region, thus improving cutoff frequency. For example, the semiconductor structure can include a fin on a substrate. The semiconductor structure can also include first and second gate structures formed on the fin and separated by a first space. The semiconductor structure can also include a third gate structure formed on the fin between the first and the second gate structures. The third gate structure can be separated from the first gate structure by a second pitch and separated from the second gate structure by a third pitch that is greater than the second pitch. The semiconductor structure further includes a source region formed between the first and third gate structures, and a drain region formed between the third and the second gate structures.
Public/Granted literature
- US20190096883A1 ASYMMETRIC GATE PITCH Public/Granted day:2019-03-28
Information query
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