Invention Grant
- Patent Title: Communication between integrated circuit packages using a millimeter-wave wireless radio fabric
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Application No.: US15745980Application Date: 2015-09-25
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Publication No.: US10476545B2Publication Date: 2019-11-12
- Inventor: Adel A. Elsherbini , Telesphor Kamgaing , Sasha N. Oster , Brandon M. Rawlings , Georgios C. Dogiamis
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- International Application: PCT/US2015/052472 WO 20150925
- International Announcement: WO2017/052651 WO 20170330
- Main IPC: H04B1/40
- IPC: H04B1/40 ; H04B1/00 ; H01L25/00 ; H01L23/00

Abstract:
Communication is described between integrated circuit packages using a millimeter-wave wireless radio fabric. In one example a first package has a radio transceiver to communicate with a radio transceiver of a second package. The second package has a radio transceiver to communicate with the radio transceiver of the first package. A switch communicates with the first package and the second package to establish a connection through the respective radio transceivers between the first package and the second package. A system board carries the first package, the second package, and the switch.
Public/Granted literature
- US20180234128A1 COMMUNICATION BETWEEN INTEGRATED CIRCUIT PACKAGES USING A MILLIMETER-WAVE WIRELESS RADIO FABRIC Public/Granted day:2018-08-16
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