Invention Grant
- Patent Title: Component mounting system
-
Application No.: US15441446Application Date: 2017-02-24
-
Publication No.: US10477746B2Publication Date: 2019-11-12
- Inventor: Hiroki Kobayashi , Chikara Takata , Yasuo Takanami , Shuzo Yagi , Tetsushi Oohori , Yoshiaki Awata
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2016-109775 20160601
- Main IPC: H05K13/02
- IPC: H05K13/02 ; H05K13/04 ; H05K13/08

Abstract:
A component mounting system includes a component mounter that mounts a component in a board, a tape feeder (component feeder) that is placed in the component mounter and supplies the component, and a mobile component supply device that holds a tape cassette (container) storing a component, automatically moves, and supplies the component in the tape cassette (container) to the tape feeder (component feeder).
Public/Granted literature
- US20170354070A1 COMPONENT MOUNTING SYSTEM Public/Granted day:2017-12-07
Information query