公开(公告)号：US10383269B2

公开(公告)日：2019-08-13

申请号：US15610893

申请日：2017-06-01

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Shuzo Yagi ,  Takashi Tamura ,  Hiroki Yamamoto ,  Toru Ikeda ,  Kazuhiro Kishikawa

IPC: H05K13/04

Abstract: In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.

公开(公告)号：US20170265342A1

公开(公告)日：2017-09-14

申请号：US15610893

申请日：2017-06-01

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Shuzo Yagi ,  Takashi Tamura ,  Hiroki Yamamoto ,  Toru Ikeda ,  Kazuhiro Kishikawa

IPC: H05K13/04

CPC classification number: H05K13/0452 ,  H05K13/0411 ,  H05K13/0434 ,  Y10T29/4913 ,  Y10T29/53174

Abstract: In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.

公开(公告)号：US10477746B2

公开(公告)日：2019-11-12

申请号：US15441446

申请日：2017-02-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroki Kobayashi ,  Chikara Takata ,  Yasuo Takanami ,  Shuzo Yagi ,  Tetsushi Oohori ,  Yoshiaki Awata

IPC: H05K13/02 ,  H05K13/04 ,  H05K13/08

Abstract: A component mounting system includes a component mounter that mounts a component in a board, a tape feeder (component feeder) that is placed in the component mounter and supplies the component, and a mobile component supply device that holds a tape cassette (container) storing a component, automatically moves, and supplies the component in the tape cassette (container) to the tape feeder (component feeder).

公开(公告)号：US20170354070A1

公开(公告)日：2017-12-07

申请号：US15441446

申请日：2017-02-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroki Kobayashi ,  Chikara Takata ,  Yasuo Takanami ,  Shuzo Yagi ,  Tetsushi Oohori ,  Yoshiaki Awata

IPC: H05K13/02

Abstract: A component mounting system includes a component mounter that mounts a component in a board, a tape feeder (component feeder) that is placed in the component mounter and supplies the component, and a mobile component supply device that holds a tape cassette (container) storing a component, automatically moves, and supplies the component in the tape cassette (container) to the tape feeder (component feeder).