Invention Grant
- Patent Title: Thermoplastic resin composition, molded article made therefrom, and method of preparing the composition
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Application No.: US14848057Application Date: 2015-09-08
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Publication No.: US10479889B2Publication Date: 2019-11-19
- Inventor: Kyunghae Lee , Seungjoon Hwang , Namsoo Park , Mooho Lee , Jun Chwae
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: KR10-2014-0194324 20141230
- Main IPC: C08L67/04
- IPC: C08L67/04 ; C08K5/00 ; C08L23/08
Abstract:
A thermoplastic resin composition including a polylactic acid, a thermoplastic polymer having a lower glass transition temperature than the polylactic acid, a nucleating agent, and a reactive plasticizer, a molded article made therefrom, and a method of preparing the thermoplastic resin composition.
Public/Granted literature
- US20160185954A1 THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE MADE THEREFROM, AND METHOD OF PREPARING THE COMPOSITION Public/Granted day:2016-06-30
Information query
