公开(公告)号：US09381498B2

公开(公告)日：2016-07-05

申请号：US14680405

申请日：2015-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonsu Heo ,  Jongmin Lee ,  Kyunghae Lee ,  Jun Chwae ,  Mooho Lee

IPC: B01J21/08 ,  C07C31/20 ,  B01J23/78 ,  C07C29/143 ,  B01J37/04 ,  B01J37/06 ,  B01J37/02

CPC classification number: B01J23/78 ,  B01J37/0201 ,  B01J37/035 ,  B01J37/04 ,  B01J37/06 ,  C07C29/143 ,  C07C29/149 ,  C07C31/207

Abstract: A method for preparing a hydrogenation catalyst by mixing a copper salt with colloidal silica to form a precipitate, washing the formed precipitate to remove anions of the copper salt from the precipitate, and impregnating the anion-removed precipitate with an alkali metal to form a hydrogenation catalyst; and a method for preparing a diol from a lactone using the hydrogenation catalyst.

Abstract translation: 一种通过将铜盐与胶体二氧化硅混合以形成沉淀物来制备氢化催化剂的方法，洗涤形成的沉淀物以从沉淀物中除去铜盐的阴离子，并用碱金属浸渍阴离子去除的沉淀物以形成氢化 催化剂; 以及使用该氢化催化剂从内酯制备二醇的方法。

公开(公告)号：US20160122531A1

公开(公告)日：2016-05-05

申请号：US14830233

申请日：2015-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chansu Kim ,  Kyunghae Lee ,  Jun Chwae ,  Mooho Lee ,  Kwangmyung Cho

IPC: C08L67/04

CPC classification number: C08L67/04 ,  C08K3/346 ,  C08K3/36 ,  C08K9/08 ,  C08K2201/003 ,  C08K2201/011 ,  C08L91/00

Abstract: A thermoplastic resin composition including a polylactic acid and organic-inorganic composite particles, wherein the composite particles include an inorganic nanoparticle core and a coating layer formed on the core, wherein the coating layer includes a copolymer, and a molded article made therefrom.

Abstract translation: 一种包含聚乳酸和有机 - 无机复合颗粒的热塑性树脂组合物，其中所述复合颗粒包括无机纳米颗粒芯和在所述芯上形成的涂层，其中所述涂层包含共聚物，以及由其制成的模塑制品。

公开(公告)号：US10479889B2

公开(公告)日：2019-11-19

申请号：US14848057

申请日：2015-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghae Lee ,  Seungjoon Hwang ,  Namsoo Park ,  Mooho Lee ,  Jun Chwae

IPC: C08L67/04 ,  C08K5/00 ,  C08L23/08

Abstract: A thermoplastic resin composition including a polylactic acid, a thermoplastic polymer having a lower glass transition temperature than the polylactic acid, a nucleating agent, and a reactive plasticizer, a molded article made therefrom, and a method of preparing the thermoplastic resin composition.

公开(公告)号：US20160108167A1

公开(公告)日：2016-04-21

申请号：US14918852

申请日：2015-10-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Inki Kim ,  Kyunghae Lee ,  Mooho Lee ,  Kwangmyung Cho

IPC: C08G18/73 ,  C08G18/32 ,  C08J5/00 ,  C08G18/38 ,  C08L67/04 ,  C08L75/04 ,  C08G18/34

CPC classification number: C08G18/73 ,  C08G18/3206 ,  C08G18/34 ,  C08G18/3844 ,  C08G18/603 ,  C08G18/606 ,  C08G18/7621 ,  C08G18/7671 ,  C08G2261/126 ,  C08J5/00 ,  C08J2367/04 ,  C08J2375/04 ,  C08J2467/04 ,  C08J2475/04 ,  C08L67/04 ,  C08L75/04 ,  C08L2207/04

Abstract: A polyurethane elastomer including a polymerization product of an amide group-including compound, a polyol compound, a polybasic acid compound, and a diisocyanate compound, a thermoplastic resin composition including the polyurethane elastomer, a molded article made of the thermoplastic resin composition, and a method of preparing the polyurethane elastomer.

Abstract translation: 包含含酰胺基化合物的聚合产物，多元醇化合物，多元酸化合物和二异氰酸酯化合物的聚氨酯弹性体，包含聚氨酯弹性体的热塑性树脂组合物，由热塑性树脂组合物制成的模塑制品，和 制备聚氨酯弹性体的方法。

公开(公告)号：US11926695B2

公开(公告)日：2024-03-12

申请号：US16898761

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeong Pang ,  In Kim ,  Jonghoon Won ,  Mooho Lee ,  Hyejeong Lee ,  Songwon Hyun

IPC: C08G59/24 ,  C08G59/26 ,  C08G59/62 ,  C08L63/00 ,  C09D5/00 ,  C09D163/00 ,  C09K5/14 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64

CPC classification number: C08G59/245 ,  C08G59/26 ,  C08G59/621 ,  C08L63/00 ,  C09D5/00 ,  C09D163/00 ,  C09K5/14 ,  H01L33/56 ,  H01L33/62 ,  H01L33/641

Abstract: A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.

E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2  Formula 1

In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.

公开(公告)号：US20160030928A1

公开(公告)日：2016-02-04

申请号：US14680405

申请日：2015-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeonsu Heo ,  Jongmin Lee ,  Kyunghae Lee ,  Jun Chwae ,  Mooho Lee

IPC: B01J23/78 ,  B01J37/02 ,  B01J37/06 ,  C07C29/143 ,  B01J37/04

CPC classification number: B01J23/78 ,  B01J37/0201 ,  B01J37/035 ,  B01J37/04 ,  B01J37/06 ,  C07C29/143 ,  C07C29/149 ,  C07C31/207

Abstract: A method for preparing a hydrogenation catalyst by mixing a copper salt with colloidal silica to form a precipitate, washing the formed precipitate to remove anions of the copper salt from the precipitate, and impregnating the anion-removed precipitate with an alkali metal to form a hydrogenation catalyst; and a method for preparing a diol from a lactone using the hydrogenation catalyst.

Abstract translation: 一种通过将铜盐与胶体二氧化硅混合以形成沉淀物来制备氢化催化剂的方法，洗涤形成的沉淀物以从沉淀物中除去铜盐的阴离子，并用碱金属浸渍阴离子去除的沉淀物以形成氢化 催化剂; 以及使用氢化催化剂从内酯制备二醇的方法。

公开(公告)号：US20210147612A1

公开(公告)日：2021-05-20

申请号：US16898761

申请日：2020-06-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeong Pang ,  In Kim ,  Jonghoon Won ,  Mooho Lee ,  Hyejeong Lee ,  Songwon Hyun

IPC: C08G59/24 ,  C08G59/26 ,  C08G59/62 ,  C08L63/00 ,  C09D163/00 ,  C09D5/00 ,  C09K5/14 ,  H01L33/56 ,  H01L33/62 ,  H01L33/64

Abstract: A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1. E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2  Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.

公开(公告)号：US10160857B2

公开(公告)日：2018-12-25

申请号：US14830233

申请日：2015-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chansu Kim ,  Kyunghae Lee ,  Jun Chwae ,  Mooho Lee ,  Kwangmyung Cho

IPC: C08L67/04 ,  C08K9/08 ,  C08K3/36

Abstract: A thermoplastic resin composition including a polylactic acid and organic-inorganic composite particles, wherein the composite particles include an inorganic nanoparticle core and a coating layer formed on the core, wherein the coating layer includes a copolymer, and a molded article made therefrom.

公开(公告)号：US20160185954A1

公开(公告)日：2016-06-30

申请号：US14848057

申请日：2015-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyunghae Lee ,  Seungjoon Hwang ,  Namsoo Park ,  Mooho Lee ,  Jun Chwae

IPC: C08L67/04 ,  C08J5/00

CPC classification number: C08L67/04 ,  C08K5/0016 ,  C08K5/0083 ,  C08L23/0846 ,  C08L23/0853

Abstract: A thermoplastic resin composition including a polylactic acid, a thermoplastic polymer having a lower glass transition temperature than the polylactic acid, a nucleating agent, and a reactive plasticizer, a molded article made therefrom, and a method of preparing the thermoplastic resin composition.

Abstract translation: 包含聚乳酸，玻璃化转变温度低于聚乳酸的热塑性聚合物，成核剂和反应性增塑剂的热塑性树脂组合物，由其制成的模制品，以及制备该热塑性树脂组合物的方法。

公开(公告)号：US11421073B2

公开(公告)日：2022-08-23

申请号：US17061345

申请日：2020-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghoon Won ,  In Kim ,  Kyeong Pang ,  Mooho Lee

IPC: C08G59/24 ,  C08K3/013 ,  C09K19/38 ,  C09K19/32 ,  C08G59/62 ,  H01L21/56

Abstract: A highly thermally conductive epoxy compound, and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package, each including the highly thermally conductive epoxy compound. The epoxy compound is represented by Chemical Formula 1 below and has at least one mesogenic naphthalene unit. E1-M1-L1-M2-L2-M3-E2  Chemical Formula 1 In Chemical Formula 1, at least one of M1, M2, or M3, which are mesogenic units, is a naphthalene unit. M1, M2, M3, L1, L2, and E1 and E2 are as defined in the detailed description.