- Patent Title: Nanowire bending for planar device process on (001) Si substrates
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Application No.: US15573772Application Date: 2016-05-13
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Publication No.: US10483105B2Publication Date: 2019-11-19
- Inventor: Seung-Chang Lee , Steven R. J. Brueck
- Applicant: STC.UNM
- Applicant Address: US NM Albuquerque
- Assignee: STC.UNM
- Current Assignee: STC.UNM
- Current Assignee Address: US NM Albuquerque
- Agency: MH2 Technology Law Group LLP
- International Application: PCT/US2016/032501 WO 20160513
- International Announcement: WO2017/023394 WO 20170209
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B81C1/00 ; B82Y10/00 ; H01L21/8238 ; H01L29/423 ; H01L29/66 ; H01L27/092 ; H01L29/786 ; H01L29/06 ; H01L21/285 ; H01L21/306 ; H01L21/311 ; B82Y40/00

Abstract:
Provided is a method for growing a nanowire, including: providing a substrate with a base portion having a first surface and at least one support structure extending above or below the first surface; forming a dielectric coating on the at least one support structure; forming a photoresist coating over the substrate; forming a metal coating over at least a portion of the dielectric coating; removing a portion of the dielectric coating to expose a surface of the at least one support structure; removing a portion of the at least one support structure to form a nanowire growth surface; growing at least one nanowire on the nanowire growth surface of a corresponding one of the at least one support structure, wherein the nanowire comprises a root end attached to the growth surface and an opposing, free end extending from the root end; and elastically bending the at least one nanowire.
Public/Granted literature
- US20180358226A1 NANOWIRE BENDING FOR PLANAR DEVICE PROCESS ON (001) Si SUBSTRATES Public/Granted day:2018-12-13
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