Invention Grant
- Patent Title: Embedded trace substrate structure and semiconductor package structure including the same
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Application No.: US15887780Application Date: 2018-02-02
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Publication No.: US10483196B2Publication Date: 2019-11-19
- Inventor: Yu-Ying Lee
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; H01L23/31 ; H01L21/48 ; H01L21/56 ; H01L21/683
Abstract:
A substrate structure includes a carrier, a first metal layer, a circuit layer and a dielectric layer. The carrier has a first surface and a second surface. The first metal layer is disposed on the first surface of the carrier. The circuit layer is disposed on the first metal layer. The dielectric layer covers the circuit layer and defines a plurality of openings to expose portions of the circuit layer and portions of the first metal layer.
Public/Granted literature
- US20180240745A1 SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2018-08-23
Information query
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