Invention Grant
- Patent Title: Electronic module and semiconductor package device
-
Application No.: US15408158Application Date: 2017-01-17
-
Publication No.: US10483254B2Publication Date: 2019-11-19
- Inventor: Chang-Lin Yeh
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L25/10
- IPC: H01L25/10 ; H01L23/04 ; H01L21/56 ; H01L25/00 ; H01L23/31 ; H01L25/11 ; H01L25/16

Abstract:
An electronic module includes a first sub-module and a second sub-module. The first sub-module includes a first substrate, a first electronic component disposed on the first substrate and a first electrode. The second sub-module includes a second substrate, a second electronic component disposed on the second substrate and a second electrode spaced from the first electrode. The second electrode faces the first electrode to form a capacitor for transmitting an alternating current (AC) signal between the first sub-module and the second sub-module.
Public/Granted literature
- US20180204824A1 ELECTRONIC MODULE AND SEMICONDUCTOR PACKAGE DEVICE Public/Granted day:2018-07-19
Information query
IPC分类: