Invention Grant
- Patent Title: Series resistor over drain region in high voltage device
-
Application No.: US15942728Application Date: 2018-04-02
-
Publication No.: US10483259B2Publication Date: 2019-11-19
- Inventor: Ker Hsiao Huo , Fu-Chih Yang , Chun Lin Tsai , Yi-Min Chen , Chih-Yuan Chan
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/417 ; H01L29/423 ; H01L27/02 ; H01L27/06 ; H01L21/8234 ; H01L49/02 ; H01L29/40 ; H01L23/522

Abstract:
Some embodiments relate to an integrated circuit. The integrated circuit includes a ring-shaped drain region having an inner edge and an outer edge. A channel region surrounds the ring-shaped drain region. A source region surrounds the channel region. The channel region separates the drain region from the source region. A gate electrode is arranged over the channel region and is separated from the channel region by a gate dielectric. An inner edge of the gate electrode is proximate to the drain region. A resistor structure is arranged over and spaced apart from an upper surface of the substrate. The resistor structure has a first end and a second end which are connected by a curved or polygonal path of resistive material. The first end is coupled to the ring-shaped drain. The resistor has an outer perimeter that is surrounded by the inner edge of the ring-shaped drain region.
Public/Granted literature
- US20180226396A1 SERIES RESISTOR OVER DRAIN REGION IN HIGH VOLTAGE DEVICE Public/Granted day:2018-08-09
Information query
IPC分类: