Method of producing an optoelectronic semiconductor component, optoelectronic semiconductor component, and temporary carrier
Abstract:
A method of producing an optoelectronic semiconductor component includes providing a carrier including two metal layers, wherein the metal layers are detachable from one another, securing an optoelectronic semiconductor chip on the first metal layer of the carrier, and mechanically detaching the second metal layer from the first metal layer.
Information query
Patent Agency Ranking
0/0